Laser Micro Machining System

Laser Micro Machining System are currently used by the automobile and medical industries, as well as in the production of semiconductors and solar cell processing. Lasers for micromachining offer a wide range of wavelengths, pulse durations (from femtoseconds to microseconds), and repetition rates (from a single pulse to megahertz). These attributes allow micro-machining with high resolution in depth and lateral dimensions.

The field of micro-machining includes manufacturing methods like drilling, cutting, and welding as well as ablation and material surface texturing, whereby it is possible to achieve very fine surface structures ranging in the micrometer domain. Such processes require rapid heating, melting, and evaporation of the material. The use of extremely short nano-, pico-, and even femtosecond pulse durations helps to minimize the thermal effects such as melting and burr formation, thus eliminating the need for any post-processing measures.

To achieve micromachining using a laser micromachining system, the actual concentrated laser spot size must be substantially smaller, maybe as tiny as a few microns. As a result, the hole drilled by such a laser point may be only a few microns in diameter. Laser micromachining is used when the material thickness is less than one millimeter and the feature size is frequently quantified in microns.

SIL’s Laser Micromachining Systems are developed for precision machining control in applications ranging from micro cutting, scribing, Micro Hole Drilling, Micro Milling, Dicing, Ablation, Engraving, and Etching to selective material removal in sectors such as microelectronics, semiconductors, and medical device manufacturing. The system can be configured with automation as per your requirements.